Indium Corporation manufactures 60 different alloys that contain indium, in addition to over 150 other non-indium-bearing alloys, such as SAC and... Read Entire Post Posted On: October 26th, 2018 | By: Indium Corporation® &
Indalloy ® 303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime reliability of the solder joint beyond that of …
INDIUM: SMT expert Phil Zarrow interviews Carol Gowans, incubator market manager for Indium Corporation, about the benefits of using low-temperature alloys bismuth and indium.
Indalloy ® 303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime …
Low-temperature eutectic solder. Can be used on the same metallizations as SnPb solders. Lowest temperature alloy available as a solder paste. 281 58Bi/42Sn 138 138 Eutectic Pb-free version. Low melting temperature that is good for step soldering applications. 282 57Bi/42Sn/1Ag 140 139 More malleable and ductile than Indalloy ®281.
Low-temperature solder alloys have also been of increased interest to the SMT industry for a variety of reasons including component sensitivity, step soldering, and reduced energy consumption. However, while the reduced temperature and subsequent energy during reflow have often been listed as a benefit, it has rarely been publicly quantified.
Indium Corporation ® does not recommend, manufacture, market, or endorse any of our products for human consumption or to treat or diagnose any disease. All of Indium Corporation ® 's products and solutions are designed to be …
Durafuse™ LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and can perform better than SAC305 with optimal process setup. Durafuse™ LT is made up of a low-melting indium …
Durafuse ® LT Durafuse ® LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C.. Durafuse ® LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process …
Indium Alloy ; Posted On: January 4th, 2024 ... We recently completed a study in partnership with Heller Industries which assessed how energy consumption changes with low-temperature solder versus traditional high-temperature solders. The difference in consumption, and therefore emissions, was stark. High-temperature solders reflowed at 240°C ...
Indium Corporation Acquires SAFI-Tech to Advance Low-Temperature Soldering Technology October 3, 2023. Indium Corporation, an international electronics materials refiner, smelter, manufacturer, and supplier, …
This low melt eutectic alloy consists of 75.5% Gallium and 24.5% Indium and is available in 10 gram increments. The melting point is 15.7 degrees and has a density of 6.2 g/cm3.This material will ship via FedEx, you must have a physical address for...
Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste June 14, 2024. Indium Corporation® is proud to introduce Durafuse® HR, a new high-reliability alloy used for solder paste, developed from the company's Durafuse® mixed-alloy technology. Durafuse® HR is a patent-pending alloy system that delivers enhanced thermal cycling …
The eutectic alloy of 58Bi 42Sn (Indalloy ® 281) melts at 138 ° C and is one of the more popular bismuth contained alloys. Low-temperature alloys (including bismuth-containing and indium-containing alloys) need special flux vehicles that have activators lower than standard SMT pastes.
Indalloy ® 303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime reliability of the …
Some alloys are nearly isostatic, resulting in a negligible amount of expansion over a wide range of temperatures. These alloys can be used as solders as well as for many other non-soldering purposes. Next we will discuss …
Bi-based low-temperature alloys are unable to withstand even moderate drop shock. Durafuse® LT is a low-temperature Pb-free solder capable of reducing peak reflow temperature by 40°C relative to SAC305, with drop shock reliability two orders of magnitude greater than standard low-temperature alloys. Durafuse ® LT samples in the
Form No. 99375 R5 PRODUCT DATA SHEET Indium5.7LT-1 Low-Temperature Solder Paste Introduction Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys. This paste is a clear residue product with exceptional wetting capabilities.
Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys. This paste is a clear residue …
Durafuse ® LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength …
One of indium metal's unique characteristics is its low-melting point. Low-temperature alloys, which typically contain indium or bismuth, melt at temperatures less than 180°C. These alloys are used in a wide variety of applications, including: Step soldering involving temperature-sensitive components
Quick activation at low temperatures allows use of alternate low temperature alloys Excellent wetting to all types of metallizations : GS-3434: X-X-62Sn / 36Pb / 2Ag 60Sn / 40Pb 96.5Sn / 3.5Ag 58Bi / 42Sn 57Bi / 42Sn / 1Ag : Invisible residue flux for Sn/Pb and Pb-free alloys : GS-1414 Preferred: X: X-X: 62Sn / 36Pb / 2Ag 60Sn / 40Pb 96.5Sn / 3 ...
High-Purity Tin. With a melting point of 231.93°C (449.47°F) and its corrosion-resistant nature, tin, especially high-purity Tin (3N5 to 6N), is becoming increasingly popular for a number of new and innovative applications, including aerospace and semiconductors.
Sn/Pb/Ag alloys: These alloys are similar to 63Sn/37Pb but use a small amount of silver to lower the melting point and to increase shear strength, wetting, and fatigue resistance - when compared to traditional Sn/Pb. Indium-based alloys: Indium-based alloys have superior thermal conductivity and ductility compared to other low-temp alloys ...
Low-Temperature Soldering. Indium Corporation makes a wide range of alloys that melt or reflow below 180°C and can be used to solve a great many assembly and other challenges. Low-temperature solder is often used in electronics …
Gold-Tin (AuSn) Solder Paste. Gold-Tin (AuSn) Solder Paste is generally used in applications that require a high-melting temperature (80Au20Sn has a melting point of 280°C / 556°F). It can be made into a variety of solder paste forms with various options to address specific applications.
Related High Purity Indium Blog Articles The Value of Low-Temperature Solder Alloys in an ESG World. 04 Jan 2024 by Indium Corporation® | View Bio. Electrification is changing the products and materials that are valued today.
Indium Corporation is a supplier of specialty solder and brazing spheres in small to mid-size volumes. We offer a wide variety of alloys and sizes from around 0.004" (100 microns) to 0.078" (1.98mm), depending on the alloy. Melting points range from below 90°C to over 700°C.
Alloys at Low Temperatures . A Review of the Literature . UNITED STATES DEPARTMENT OF COMMERCE . ... 35 31 Indium. Gold . 13, 12a 24, 23 24 . Indium . 16 29 Iridium . 10, 10a 18, 19 Iron . 8, 9 16, 17 16 Lanthanum . 9 . ... If measurements were made at only 1 or 2 temperatures, representative conductivity
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework. Author(s): Dr. Ronald C. Lasky, Ed Briggs Summary: The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, …